基于CircuitWorks的研究与PCB板的制造

基于 CircuitWorks 的研究与 PCB 板的制造 作者：丁晓军 学号：12010130384 指
导教师：段建中 2011 年 7 月 2 日 目 录第一章CircuitWorks简
介 .................................................................................................................2 1.1
CircuitWorks来
源 ...............................................................................................................2 1.2
CircuitWorks优
点 ...............................................................................................................2 1.3
CircuitWorks操作界
面 .......................................................................................................2 1.4 CircuitWorks快
速入门 .......................................................................................................3第二章 电路
板的基本知识.............................................................................................................3 2.1
PCB板的组
成 .....................................................................................................................3 2.2 PCB板
的主要分类 .............................................................................................................4 2.3
PCB板的工作层
面 .............................................................................................................5 2.4 PCB板的设
计过程 .............................................................................................................6 2.5 PCB板
的测试方法 .............................................................................................................7 2.6
PCB板的维修知
识 .............................................................................................................8 2.7 PCB板的维
修费用标准 .....................................................................................................9第三章
Protel DXP2004 软件教
程 ...............................................................................................10 3.1 教程
一..............................................................................................................................10 3.2
教程二..............................................................................................................................10
第四章 工业上制造PCB
板 ...........................................................................................................10 4.1 PCB制作的
准备 ...............................................................................................................10 4.2 PCB流
程制作 ...................................................................................................................12 4.2.1
PCB的层别 ............................................................................................................12 4.2.2
内层板生产步骤.................................................................................................12 4.3 内
层线路板成型段...........................................................................................................16
4.3.1 压合.....................................................................................................................16
4.3.2 钻孔.....................................................................................................................17
4.3.3 镀铜.....................................................................................................................18
4.4 外层线路板成型
段...........................................................................................................19 4.5 多层板后续
流程...............................................................................................................20 4.5.1 防
焊.................................................................................. ...................................20 4.5.2 文
字.....................................................................................................................21 4.5.3 加工
Surface Treatment Process .......................................................................21 4.5.4 成