Guiplus_MID_ V1.01_制板说明_090913_

原理图

PCB FORMATION

Luke

1+4+1

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符合Rohs 标准并且适应无铅焊接要求 Total PCB thickness:

1.1mm -0.1mm

Layer 6 Microvias VIA8 Standardvias VIA12

Minimum Hole dia. Microvia: 8mil Minimum Hole dia. Standardvia 12mil Minimum track width: Minimum clearance: Track width tolerance:

Minimum width for annular rings PCB dielectric const.:

Prepreg materials 2125/1080 Or 2116 Core Thickness

4mil

4mil ±2mil 6mil.

FR4 4.6 (measured at 1 MHz) 4.0≦Er≦4.6

Minimum clearance on innerlayer track to nonplated hole 2mil

Structure/build: Symmetrical Core materials FR4 S1141- Epoxi woven glass, flame retardant grade 4 sheet

See Material build-up

See Material build-up

Plating Chemical NI/Gold and OSP in BGA area Soldermask Thickness Photopolymer liquid film, 5-50 µm (Layer4 0.107 mm) Impedance Stripline layer4 ref to layer3 &layer5 90?

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Impedance Layer1 to layer3

50?1. 0.650mm)

Nemochips,Ltd Page 1 of 6

原理图

PCB FORMATION

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? For PCB X-out: Black mark in Bad Mark Area (See PCB Type Setting). Along breakaway section of the PCB, Copper may be used Along breakaway section of the PCB, balanced copper may be used Copper from edge of PCB Maximum 10mil All Vias must be plugged unless otherwise specified. Expection: Vias that on pads need not to be plugged.

Note: For any parameters within Gerber files that are less than the values listed above, the Gerber file parameters will take precedence over the values listed above. All other deviations will needed to be discussed with Simcom and approval given before start of PCB fabrication.

Nemochips,Ltd Page 2 of 6

原理图

PCB FORMATION

MATERIAL BUILD-UP

Electroless Nickel+ Chemical Gold+ Solder Mask 25 µm.

LAYER1 Copper 35.0 µm.

PP 100.0 µmLAYER2 Copper 18.0 µm. Core 250.0 µm.

LAYER3 Copper 18.0 µm.

PP 100.0 LAYER4 Copper 18.0µm. Core 250.0um LAYER5 Copper 18.0 PP 100.0µm

LAYER6 Copper 35.0 µm.

Electroless Nickel+ Chemical Gold+ Solder Mask 25 µm.

TOTAL OVERALL THICKNESS 1.0 mm ±0.1mm

TOLERANCES:

Plated through hole ± 0.080mm

Non-plated through hole ± 0.050mm

Core ±20%

Prepreg ±10%

RCC foil ±10%

Copper Thickness through hole Minimum 20.0u.

Copper Thickness buried hole Minimum 12.7u.

Copper Thickness Outer L1/L8 Nominal 35 u.

Copper Thickness Inner L2/L7 Nominal 35 u.

Copper Thickness Inner L3/L4 Nominal 18.0 u.

Copper Thickness Inner L5/L6 Nominal 18.0 u.

Solder Mask Thickness Nominal 18.0 u.

Chemical Gold Thickness Nominal 0.05 u

Electroless Nickel Nominal 2.54u.

BUILD-UP

Nemochips,Ltd Page 3 of 6

原理图

PCB FORMATION

Nemochips,Ltd Page 4 of 6

原理图

PCB FORMATION

CAM Documents:

Layer 1 TOPSILK.pho Silkscreen L1 Gerber Layer 1 TOPPAST.pho Past Mask L1 Gerber Layer 1 TOPSOLD.pho Solder Mask L1 Gerber Layer 1 art001.pho Outer Copper L1 Gerber Layer 2 art002.pho Inner Copper L2 Gerber Layer 3 art003.pho Inner Copper L3 Gerber Layer 4 art004.pho Inner Copper L4 Gerber Layer 5 art005.pho Inner Copper L5 Gerber Layer 6 art006.pho Inner Copper L6 Gerber Layer 7 art007.pho Inner Copper L7 Gerber Layer 8 art008.pho Outer Copper L8 Gerber Layer 8 BOTMSOLD.pho Solder Mask L8 Gerber Layer 8 BOTMPAST.pho Past Mask L8 Gerber Layer 8 BOTMSILK.pho Silkscreen L8 Gerber

Drill

Layers 1-2 drl1-2.drl Blind Drill 1-2 Excellon Layers 1-2 drl1-2.lst Blind Drill 1-2 Excellon Layers 1-2 drl1-2.rep Blind Drill 1-2 Excellon Layers 2-7 drl2-7.drl Bury Drill 2-7 Excellon Layers 2-7 drl2-7.lst Bury Drill 2-7 Excellon Layers 2-7 drl2-7.rep Bury Drill 2-7 Excellon Layers 7-8 DRILL7-8.drl Blind Drill 7-8 Excellon Layers 7-8 DRILL7-8.lst Blind Drill 7-8 Excellon Layers 7-8 DRILL7-8.rep Blind Drill 7-8 Excellon

Drill tab

drilldrw.pho

drilldrw.rep

Nemochips,Ltd Page 5 of 6