AD83586B_Datasheet_Rev 0.03

2.1通道,带EQ,DRC功能数字音频功放IC,您值得拥有!

ESMT Preliminary AD83586B

2x25W Stereo / 1x 50W Mono / 2x15W+1x30W 2.1CH

Digital Audio Amplifier with 20 Bands EQ ?? 16/18/20/24-bits input with IS, Left-alignment and Right-alignment data format ?? PSNR & DR (A-weighting)

Stereo: 98dB (PSNR), 107dB (DR) @24V ?? Multiple sampling frequencies (Fs) 32kHz / 44.1kHz / 48kHz and 64kHz / 88.2kHz / 96kHz and 128kHz / 176.4kHz / 192kHz

?? System clock = 64x, 128x, 192x, 256x, 384x, 512x, 576x, 768x, 1024x Fs

64x~1024x Fs for 32kHz / 44.1kHz / 48kHz 64x~512x Fs for 64kHz / 88.2kHz / 96kHz 64x~256x Fs for 128kHz / 176.4kHz / 192kHz ?? BCLK system supports ?? Supply voltage 3.3V for digital circuit

7V~26V for loudspeaker driver

?? Loudspeaker output power for stereo at 24V 25W x 2CH into 4? @0.17% THD+N ?? Loudspeaker output power for mono at 24V 50W x 1CH into 4? @0.09% THD+N ?? Loudspeaker output power for 2.1CH at 24V 15W x 2CH into 8? @0.17% THD+N 30W x 1CH into 4? @0.18% THD+N ?? Sound processing including： 20 bands parametric speaker EQ

Volume control (+24dB~-103dB, 0.125dB/step), Dynamic range control

Dual Band Dynamic range control Power Clipping 3D surround sound Channel mixing

Noise gate with hysteresis window Bass/Treble tone control

Bass management crossover filter DC-blocking high-pass filter ?? Power on reset ?? Anti-pop design

?? IC control interface (without MCLK) with selectable device address

?? Support hardware and software reset

Elite Semiconductor Memory Technology Inc.

2

2

?? Internal PLL

?? LV Under-voltage shutdown and HV Under-voltage detection

?? Short-circuit and over-temperature protection ?? Power saving mode ?? Tunable surround sounds ?? Support initial EEPROM setting

?? CD and DVD ?? TV audio ?? Car audio ?? Boom-box

?? MP3 docking systems ?? Powered speaker ?? Wireless audio

AD83586B is a digital audio amplifier capable of driving a pair of 8?, 15W plus a single 4?, 30W, or a pair of 4?, 25W or a single 4?, 50W speaker operating at 24V supply with proper cooling method.

AD83586B can provide advanced audio processing capabilities, such as volume control, 20 bands speaker EQ, audio mixing, 3D surround and Dynamic Range Control

(DRC).

These

functions

2

are fully

programmable via a simple IC control interface. Robust protection circuits are provided to protect AD83586B from damage due to accidental erroneous operating condition. AD83586B is more tolerant to noise and PVT (Process, Voltage, and Temperature) variation than the analog Class-AB or Class-D audio amplifier counterpart implemented by analog circuit design. AD83586B is pop free during instantaneous power switch because of its built-in, robust anti-pop circuit.

The output stage is flexibly configurable for 2.1 channel, stereo or mono applications. Furthermore, it is possible to use three pieces of AD83586B to realize 5.1 channels for home theater applications.

Publication Date: Dec. 2014 Revision: 0.03 1/62

2.1通道,带EQ,DRC功能数字音频功放IC,您值得拥有!

ESMT Preliminary AD83586B

VDDRARAGNDRRBLAVDDLAGNDS1S1AVDDS1N.C.

N.C.VDDS2S2AGNDS2S2BVDDS2

VDDS1S1B

Revision: 0.03 2/62

2.1通道,带EQ,DRC功能数字音频功放IC,您值得拥有!

ESMT Preliminary AD83586B

Revision: 0.03 3/62

2.1通道,带EQ,DRC功能数字音频功放IC,您值得拥有!

ESMT Preliminary AD83586B

AD83586B

Line 1 : LOGO

Line 2 : Product no.

Line 3 : Tracking Code

Line 4 : Date Code

PIN1 DOT

Elite Semiconductor Memory Technology Inc.

Publication Date: Dec. 2014 Revision: 0.03 4/62

2.1通道,带EQ,DRC功能数字音频功放IC,您值得拥有!

ESMT Preliminary AD83586B

Product ID AD83586B-LG48NAY

Package E-LQFP-48L 7x7 mm

Packing / MPQ 250 Units / Tray 2.5K Units / Box (10 Tray)

Comments Green

Package Type 7x7 48L E-LQFP

Device No. AD83586B

θja(℃/W) 27.4

Ψjt(℃/W) θjt(℃/W) 1.33

34.9

Exposed Thermal Pad

Yes (Note1)

Note 1.1: The thermal pad is located at the bottom of the package. To optimize thermal performance,

soldering the thermal pad to the PCB’s ground plane is suggested.

Note 1.2: θja, the junction-to-ambient thermal resistance is simulated on a room temperature (TA=25℃), natural

convection environment test board, which is constructed with a thermally efficient, 4-layers PCB (2S2P). The simulation is tested using the JESD51-5 thermal measurement standard.

Note 1.3: Ψjt represents the thermal parameter for the heat flow between the chip junction and the package’s

top surface center. It’s extracted from the simulation data for obtainingθja, using a procedure described in JESD51-2.

Note 1.4: θjt represents the thermal resistance for the heat flow between the chip junction and the package’s

top surface. It’s extracted from the simulation data with obtaining a cold plate on the package top.

Stresses beyond those listed under

Symbol DVDD PVDD Vi Tstg TJ

Parameter Supply for Digital Circuit

Supply for Driver Stage (VDDL/VDDR/VDDS1/VDDS2)

Input Voltage Storage Temperature Junction Operating Temperature

Min -0.3 -0.3 -0.3 -65 0

Max 3.6 30 3.6 150 150

Units V V V

oo

C C

Elite Semiconductor Memory Technology Inc.

Publication Date: Dec. 2014

Revision: 0.03

5/62